Method of manufacturing circuit board structure

ABSTRACT

A circuit board structure includes a circuit layer structure, an electronic component, and a stopper. The circuit layer structure includes a plurality of dielectric layers and circuits in the dielectric layers. The electronic component is disposed in the circuit layer structure; the electronic component includes a chip and a conductive bump; the chip has a first surface and a second surface that are oppositely disposed, and the first surface of the chip contacts one of the dielectric layers; the conductive bump is on the second surface of the chip and is electrically connected to the chip. The stopper is within the circuit layer structure and abuts against the conductive bump. A method for fabricating a circuit board structure is also provided herein.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a Divisional Application of the U.S.Application Ser. No. 16/544,936, filed Aug. 20, 2019, which claimspriority to Taiwan Application Serial Number 108124560, filed Jul. 11,2019, all of which are herein incorporated by reference in theirentireties.

BACKGROUND Field of Invention

The present disclosure relates to a circuit board structure having anelectronic component, particularly a circuit board structure having anembedded electronic component.

Description of Related Art

In the conventional manufacturing technology relates to circuit boardshaving embedded electronic components, when the electronic componentsare mounted on the substrate, the mounting accuracy of the electroniccomponents is affected by the mounting device, and each of theelectronic components has a random offset.

Referring to FIGS. 1A and 1B, which are respectively a cross-sectionalview and a top view illustrating a circuit board structure made by theconventional technique. As shown in FIG. 1A, when a chip 12 is mountedon a substrate 14 by a mounting device, offset occurs. FIG. 1B shows thealignment deviation between the chip 12 and the chip placement area 16on the substrate 14.

The electronic components offset at the predetermined positions in thecarrier board, and such condition will result in inaccurate processingof the vias or the circuit layers formed by the subsequent process.Therefore, the offset mounting of electronic components is a criticalissue that needs to be solved.

SUMMARY

Some embodiments of the present disclosure provide a circuit boardstructure comprising a circuit layer structure, an electronic component,and a stopper. The circuit layer structure includes a plurality ofdielectric layers and circuits in the dielectric layers. The electroniccomponent is disposed in the circuit layer structure; the electroniccomponent includes a chip and a conductive bump; the chip has a firstsurface and a second surface that are oppositely disposed, and the firstsurface of the chip contacts one of the dielectric layers; theconductive bump is on the second surface of the chip. The stopper iswithin the circuit layer structure and abuts against the conductivebump.

In some embodiments, the stopper has a first portion and a secondportion that is perpendicular to the first portion.

In some embodiments, the stopper abuts against the conductive bump in afirst direction and a second direction that is perpendicular to thefirst direction.

In some embodiments, the circuit layer structure further includes aninsulating layer and a via in the insulating layer, the insulating layeris over the second surface of the chip, and the via is electricallyconnected to the conductive bump.

In some embodiments, the circuit board structure further includes anadhesive layer which is positioned between the second surface of thechip and the insulating layer and adheres to the conductive bumps.

Some embodiments of the present disclosure also provide a method formanufacturing a circuit board structure; the method comprises: providinga carrier board having a release layer; forming a stopper over thecarrier board; disposing an adhesive layer over the carrier board;abutting the conductive bump of an electronic component against thestopper and placing the electronic component over the carrier board;performing build-up process; and removing the carrier board.

In some embodiments, wherein the electronic component comprises a chiphaving a first surface and a second surface that are oppositelydisposed, and the conductive bump is located on the second surface;wherein the performing the build-up process comprising: forming aplurality of dielectric layers and circuits in the dielectric layersover the first surface of the chip.

In some embodiments, the method further comprises forming an outer layerover the second surface of the chip and the conductive bump, and theouter layer comprises an insulating layer, a via, and a patternedcircuit layer. The via is within the insulating layer and iselectrically connected to the conductive bump. The patterned circuitlayer is over the insulating layer and is electrically connected to thevia.

In some embodiments, the operation of abutting the conductive bump ofthe electronic component against the stopper and placing the electroniccomponent over the carrier board comprises: abutting the conductive bumpagainst the first portion of the stopper; and abutting the conductivebump against the second portion of the stopper, wherein the secondportion is perpendicular to the first portion.

In some embodiments, the operation of disposing an adhesive layer overthe carrier board comprises covering the stopper with the adhesivelayer.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A is a cross-sectional view illustrating a conventional circuitboard structure.

FIG. 1B is a top view illustrating a conventional circuit boardstructure.

FIG. 2 shows a flow chart of a method of fabricating a circuit boardstructure in accordance with embodiments of the present disclosure.

FIG. 3A is a cross-sectional view illustrating a circuit board structureat one of the manufacturing stages in accordance with embodiments of thepresent disclosure.

FIG. 3B is a top view illustrating a circuit board structure at one ofthe manufacturing stages in accordance with embodiments of the presentdisclosure.

FIG. 4A is a cross-sectional view illustrating a circuit board structureat one of the manufacturing stages in accordance with embodiments of thepresent disclosure.

FIG. 4B is a top view illustrating a circuit board structure at one ofthe manufacturing stages in accordance with embodiments of the presentdisclosure.

FIG. 5A is a cross-sectional view illustrating a circuit board structureat one of the manufacturing stages in accordance with embodiments of thepresent disclosure.

FIG. 5B is a top view illustrating a circuit board structure at one ofthe manufacturing stages in accordance with embodiments of the presentdisclosure.

FIG. 6A is a cross-sectional view illustrating a circuit board structureat one of the manufacturing stages in accordance with embodiments of thepresent disclosure.

FIG. 6B is a top view illustrating a circuit board structure at one ofthe manufacturing stages in accordance with embodiments of the presentdisclosure.

FIG. 7A is a cross-sectional view illustrating a circuit board structureat one of the manufacturing stages in accordance with embodiments of thepresent disclosure.

FIG. 7B is a partial enlarged view of FIG. 7A.

FIG. 7C is a cross-sectional view illustrating a circuit board structureat one of the manufacturing stages in accordance with embodiments of thepresent disclosure.

FIG. 7D is a partial enlarged view of FIG. 7C.

FIG. 7E is a cross-sectional view illustrating a circuit board structureat one of the manufacturing stages in accordance with embodiments of thepresent disclosure.

FIG. 7F is a partial enlarged view of FIG. 7E.

FIG. 7G is a cross-sectional view illustrating a circuit board structureat one of the manufacturing stages in accordance with embodiments of thepresent disclosure.

FIG. 7H is a partial enlarged view of FIG. 7G.

FIGS. 8 to 11 are cross-sectional views illustrating a circuit boardstructure respectively at one of the various manufacturing stages inaccordance with embodiments of the present disclosure.

FIG. 12 is a cross-sectional view illustrating a circuit board structurein accordance with embodiments of the present disclosure.

FIG. 13 is a top view illustrating a circuit board structure at one ofthe manufacturing stages in accordance with embodiments of the presentdisclosure.

FIG. 14 is a top view illustrating a circuit board structure inaccordance with embodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

While the method of the present disclosure is described below as aseries of operations or steps, it will be appreciated that theillustrated order of such operations or steps should not be interpretedto be limiting for the present disclosure. For example, some operationsor steps may be performed in a different order and/or concurrently withother operations or steps. In addition, not all of the illustratedoperations, steps, and/or characteristics are required to implement theembodiments of the present disclosure. Further, each of the operationsor steps depicted herein may include several sub-steps or actions.

Some embodiments of the present disclosure provide a circuit boardstructure and a manufacturing method thereof; the circuit boardstructure can be applied to, but not limited to, a package carrierboard, or a printed circuit board.

FIG. 2 shows a flow chart of a method 100 for fabricating a circuitboard structure, including operations 102 through 118, in accordancewith some embodiments of the present disclosure. It is noted that themethod 100 is merely exemplary and is not intended to limit thedisclosure. FIGS. 3A through 11 are schematic views illustrating thecircuit board structure at one of the various manufacturing stages,respectively.

Referring to FIGS. 2, 3A, and 3B, in operation 102 of the method 100,the carrier board having a release layer is provided. FIG. 3A is across-sectional view of the carrier board 200, and FIG. 3B is a top viewof the carrier board 200. The carrier board 200 includes a support layer202, a release layer 204 over the support layer 202, and a metal layer206 over the release layer 204. The release layer 204 is configured tofacilitate separation of the carrier board 200 from the precursorstructure formed thereon in a later step, which will be described inmore detail below.

The support layer 202 may be made of organic polymeric material such asepoxy, polyimide (PI), polyethylene terephthalate (PET), and/orbismaleimide triazine (BT), or the like. The release layer 204 may beformed, for example, by treating a plastic film with plasma or coatingwith fluorine, or by coating a silicone release agent on the surface ofa thin membranous material such as polyethylene terephthalate (PET),polyethylene (PE) or oriented polypropylene (OPP). The material of themetal layer 206 may be, for example, copper, aluminum, or other suitableelectrically conductive material.

Referring to FIGS. 2, 4A, 4B, in operation 104 of the method 100, astopper is formed over the carrier board. FIG. 4A illustrates a stopper300 is formed over the metal layer 206. FIG. 4B is a top viewillustrating the stopper 300 containing a first portion 302 and a secondportion 304 that is perpendicular to the first portion 302. In otherwords, the stopper 300 has a right-angle shape structure. In otherembodiments, the first portion and the second portion may be spacedapart; in other words, the first portion and the second portion are notjoined together.

The material of the stopper 300 may be metal, plastic material, resin,or the like. For example, the material of the stopper 300 is prepreg,Ajinomoto Build-up Film (ABF), photoimageable dielectric (PID), phenolicresin, epoxy resin, polyamide resin, polytetrafluoroethylene (Teflon),or the like. The stopper 300 may be formed by using, for example,electroplating, electroless plating, sputtering, coating, printing,etc., or maybe in combination with lithography.

Please refer to FIGS. 2, 5A, and 5B. In operation 106 of method 100, apatterned metal layer is formed over the carrier board. FIG. 5Aillustrates a patterned metal layer 208 is formed over the metal layer206. FIG. 5B is a top view illustrating the patterned metal layer 208distributed over the surface of the metal layer 206. The patterned metallayer 208 may include conductive plugs and conductive circuits.

Formation of the patterned metal layer 208 may be performed by thefollowing steps; firstly, a photoresist layer such as a dry film (notshown) is formed on the metal layer 206; then, the photoresist layer ispatterned to expose portions of the metal layer 206 through lithographyprocess. Thereafter, processes such as electroplating and a removalprocess for the photoresist layer are performed to form the patternedmetal layer 208.

Please refer to FIGS. 2, 6A, and 6B. In operation 108 of the method 100,an adhesive layer is disposed over the carrier board. FIGS. 6A and 6Billustrate an adhesive layer 220 is disposed over the metal layer 206.The adhesive layer 220 may be disposed through lamination, printing,coating, or the like. The material of the adhesive layer 220 maycomprise, for example, resin or other suitable material. In someembodiments, the material of the adhesive layer 220 may be a thermalcuring adhesive.

The adhesive layer 220 is configured to adhere and secure the conductivebumps of the electronic component in the subsequent processes. As shownin FIGS. 6A and 6B, in some embodiments, the adhesive layer 220 coversthe stopper 300. In some embodiments, the thickness T₂₂₀ of the adhesivelayer 220 is smaller than the thickness T₂₀₈ of the patterned metallayer 208. In some embodiments, the thickness T₂₂₀ of the adhesive layer220 is not greater than the height of the conductive bumps of theelectronic component to be mounted later.

Please refer to FIGS. 2, and 7A through 7H. In operation 110 of themethod 100, the conductive bump of the electronic component is disposedto abut against the stopper and the electronic component is placed overthe carrier board. FIGS. 7A, 7C, 7E, and 7G illustrate an exemplaryprocess for placing an electronic component. FIGS. 7B, 7D, 7F, and 7Hare corresponding partial enlarged views, respectively. The electroniccomponent 310 includes a chip 320 and a conductive bump 330. The chip320 has a first surface 322 and a second surface 324 that are oppositelydisposed, and the conductive bump 330 is located on the second surface324 of the chip 320. The mounting device 20 can absorb the first surface322 of the chip 320 using, for example, vacuum suction, to make theconductive bump 330 facing the surface of the metal layer 206 of thecarrier board 200.

As shown in FIGS. 7A and 7B, firstly, the electronic component 310 ismoved downward until the conductive bump 330 is located within theadhesive layer 220 and the bottom surface 332 of the conductive bump 330is lower than the top surface 306 of the stopper 300.

Next, as shown in FIGS. 7C and 7D, the electronic component 310 is movedin the first direction x until the conductive bump 330 touches the firstportion 302 of the stopper 300. Therefore, the position of theconductive bump 330 in the first direction x is determined.

Next, as shown in FIGS. 7E and 7F, the electronic component 310 is movedin a second direction y perpendicular to the first direction x until theconductive bump 330 touches the second portion 304 (which isperpendicular to the first portion 302 and is not shown in this figure)of the stopper 300. Therefore, the position of the conductive bump 330in the second direction y is determined.

Next, as shown in FIGS. 7G and 7H, the electronic component 310 is moveddownward again until the conductive bump 330 contacts (either directlyor indirectly contacts) the metal layer 206 of the carrier board 200. Inaddition, the adhesive layer 220 surrounds the conductive bump 330. Inother words, the adhesive layer 220 is positioned between the metallayer 206 and the chip 320 and fills the space between the plurality ofconductive bumps 330.

In some embodiments, when the adhesive layer 220 is a thermal curingadhesive, the conductive bumps 330 of the electronic component 310 canbe fixed by a baking process.

As shown in FIGS. 7A through 7H, when the electronic component 310 isplaced, the first portion 302 of the stopper 300 abuts against theconductive bump in the first direction x, the second portion 304 of thestopper 300 abuts against the conductive bump in the second direction y(refers to FIG. 4B), and the conductive bump 330 is adhered and fixed inthe adhesive layer 220. Therefore, the stopper 300 can guide theelectronic component 310 to be accurately placed at a predeterminedposition on the carrier board 200 during the mounting process.

Next, referring to FIGS. 2 and 8, in operation 112 of the method 100,build-up process is performed to form a precursor structure. FIG. 8illustrates the build-up process is performed over the first surface 322of the chip 320. A laminar circuit structure 400 may be formed byperforming build-up process and laser-drilling techniques; the laminarcircuit structure 400 comprises: dielectric layers, for example, a firstdielectric layer 402 a, a second dielectric layer 402 b, and a thirddielectric layer 402 c; patterned circuit layers, for example, the firstpatterned circuit layer 404 in the second dielectric layer 402 b, thesecond patterned circuit layer 406 in the third dielectric layer 402 c,the third patterned circuit layer 408 on the third dielectric layer 402c; and vias, for example, a plurality of first vias 410 in the firstdielectric layer 402 a, a plurality of second vias 412 in the seconddielectric layer 402 b, and a plurality of third vias 414 in the thirddielectric layer 402 c. In the present disclosure, the number of thecircuit layers by the build-up process is not limited, and the numbercan be adjusted as needed.

The material of the first, second, and third dielectric layers 402 a,402 b, and 402 c may include prepreg, Ajinomoto Build-up Film (ABF),photosensitive dielectric (PID), resin, or the like. For example, theresin may be phenolic resin, epoxy resin, polyimide resin, orpolytetrafluoroethylene. The materials of the first, second, and thethird patterned circuit layers 404, 406, and 408 may be, for example,copper, aluminum, or other suitable electrically conductive material.The materials of the first, second, and third vias 410, 412, and 414 maybe, for example, copper, aluminum, or other suitable electricallyconductive material.

FIG. 8 illustrates a precursor structure 402 is formed over the carrierboard 200; the precursor structure 420 includes the patterned metallayer 208, the adhesive layer 220, the electronic component 310, thestopper 300, and the laminar circuit structure 400.

As shown in FIG. 8, the patterned metal layer 208 is electricallyconnected to the circuits of the laminar circuit structure 400, forexample, the first via 410, the first patterned circuit layer 404, thesecond via 412, the second patterned circuit layer 406, the third via414, and the third patterned circuit layer 408. Further, a portion ofthe circuits of the third patterned circuit layer 408 can serve as anelectrically conductive pad 408 a.

Next, referring to FIGS. 2 and 9, in operation 114 of the method 100,the carrier board is removed. Since the carrier board 200 includes therelease layer 204, the precursor structure 420 can be separated from thecarrier board 200 by lifting off or other stripping techniques. Themetal layer 206 may be also removed during or after the separation ofthe carrier board 200. FIG. 9 is a schematic view showing the carrierboard 200 has been removed and the precursor structure 420 is turnedupside down. After the carrier board 200 is removed, the patterned metallayer 208, the adhesive layer 220, the stopper 300, and the conductivebumps 330 are exposed. In addition, the upper surfaces of the patternedmetal layer 208, the adhesive layer 220, the stopper 300, and theconductive bumps 330 are substantially even.

Next, referring to FIGS. 2 and 10, in operation 116 of the method 100,an outer layer is formed. First, an insulating layer 432 is formed overthe patterned metal layer 208, the adhesive layer 220, the stopper 300,and the conductive bump 330. Then, a plurality of via openings can beformed in the insulating layer 432 by using, for example, laser-drillingor lithography techniques; the via openings expose portions of thesurfaces of the patterned metal layer 208 and the conductive bumps 330.Thereafter, a photoresist layer (now shown) such as a dry film is formedon the insulating layer 432, and the photoresist layer is patterned toexpose portions of the insulating layer 432 and the via openings bylithography process. Then, a deposition process such as electroplatingand a removal process of the photoresist layer are performed to formfourth vias 434, fifth vias 436, and a fourth patterned circuit layer438.

FIG. 10 illustrates the outer layer 430 is formed over the patternedmetal layer 208, the adhesive layer 220, the stopper 300, and theconductive bump 330. The outer layer 430 includes the insulating layer432, the forth via 434, the fifth via 436, and the fourth patternedcircuit layer 438. The insulating layer 432 covers the patterned metallayer 208, the adhesive layer 220, the stopper 300, and the conductivebump 330. The fourth via 434 is within the insulating layer 432 and iselectrically connected to the patterned metal layer 208. The fifth via436 is within the insulating layer 432 and is electrically connected tothe conductive bump 330. The fourth patterned circuit layer 438 islocated over the insulating layer 432 and electrically connected to thefourth via 434 and the fifth via 436. Further, a portion of the circuitsof the fourth patterned circuit layer 438 can serve as an electricallyconductive pad 438 a.

The material of the insulating layer 432 may include prepreg, AjinomotoBuild-up Film (ABF), photoimageable dielectric (PID), resin, or thelike. For example, the resin may be phenolic resin, epoxy resin,polyamide resin, or polytetrafluoroethylene. The material of the fourthvia 434 and the fifth via 435 may be, for example, copper, aluminum, orother suitable electrically conductive material. The material of thefourth patterned circuit layer 438 may be, for example, copper,aluminum, or other suitable electrically conductive material.

As shown in FIG. 10, the outer layer 430, the patterned metal layer 208,and the laminar circuit structure 400 can be collectively referred to asa circuit layer structure 431.

Next, please refer to FIGS. 2 and 11, in operation 118 of the method100, a solder mask layer is formed. As shown in FIG. 11, a first soldermask layer 440 is formed on the outer side of the laminar circuitstructure 400; the first solder mask layer 440 has openings exposing theelectrically conductive pads 408 a of the third patterned circuit layer408. The second solder mask layer 442 is formed on the outer side of theouter layer 430; the second solder mask layer 442 has openings exposingthe electrically conductive pads 438 a of the fourth patterned circuitlayer 438. The material of the first solder mask layer 440 and thesecond solder mask layer 442 may be, for example, green lacquer or othersuitable material. The first solder mask layer 440 and the second soldermask layer 442 may be formed by coating, printing, or the like.

Some embodiments of the present disclosure also provide a circuit boardstructure; referring to FIG. 12, the circuit board structure 500includes a circuit layer structure 510, an electronic component 520, anda stopper 530. The circuit layer structure 510 includes a plurality ofdielectric layers 512 (e.g., the first, second, and third dielectriclayers 512 a, 512 b, and 512 c) and the circuits 514 in the dielectriclayers 512; the circuit layer structure 510 further comprises aninsulating layer 513 located over the dielectric layers 512. Theelectronic component 520 is disposed in the circuit layer structure 510and between the first dielectric layer 512 a and the insulating layer513; the electronic component 520 includes a chip 522 and a conductivebump 524, and the chip 522 has a first surface 522 a and a secondsurface 522 b that are oppositely disposed to each other; the conductivebump 524 is on the second surface 522 b of the chip 522. The stopper 530is within the circuit layer structure 510 and abuts against theconductive bump 524.

As shown in FIG. 12, the circuit layer structure 510 further includesvias 516 within the insulating layer 513 and electrically connected tothe conductive bump 524.

As shown in FIG. 12, the circuit board structure 500 further includes anadhesive layer 518 which is located between the second surface 522 b ofthe chip 522 and the first dielectric layer 512 a and adheres to theconductive bump 524.

In addition, solder mask layers 540 and 542 are respectively disposed onthe two opposite outer sides of the circuit layer structure 510 toprotect the circuit layer structure 510.

As shown in FIG. 12, an aspect of the present disclosure provides acircuit board structure 500 for embedded electronic components,including a circuit layer structure 510, an electronic component 520,and a stopper 530. The circuit layer structure 510 includes a pluralityof dielectric layers 512 and circuits 514 in the dielectric layers 512.The electronic component 520 is disposed within the circuit layerstructure 510; the electronic component 520 includes a chip 522 and aconductive bump 524; the chip 522 has a first surface 522 a and a secondsurface 522 b that are oppositely disposed; the first surface 522 a ofthe chip 522 contacts a dielectric layer 512 a of the dielectric layers512; the conductive bump 524 is located on the second surface 522 b ofthe chip 522. The stopper 530 is within the circuit layer structure 510and abuts against the conductive bump 524.

FIG. 13 is a top view of a circuit board structure 600 at one of themanufacturing stages in accordance with some embodiments. FIG. 13illustrates the relative positional relationship between the conductivebumps 624, the chip 622, and the stopper 630. In addition, a pluralityof conductive plugs 610 are distributed in the circuit board structure600. The first portion 632 and the second portion 634 of the stopper 630are at right angles, and one of the conductive bumps 624 abuts againstthe first portion 632 of the stopper 630 in a first direction x, and theone of the conductive bumps 624 abuts against the second portion 634 ofthe stopper 630 in a second direction y perpendicular to the firstdirection x. It is noted that the circuit board structure illustrated inFIG. 13 is merely an example; in other embodiments, the stopper 630 maynot be seen from the top view, or the stopper 630 may be disposed atother positions relative to the chip 622. In fact, the stopper 630 canbe disposed at any location that abuts any of the conductive bumps 624of the electronic components, preferably abuts the conductive bump 624located at a corner of the rectangular shape of the chip 622.

FIG. 14 is a top view of a circuit board structure 700 in accordancewith some embodiments, and the figure shows that the chips 722 areaccurately mounted in the chip placement areas 702 in the circuit boardstructure 700.

The present disclosure provides a circuit board structure for embeddedelectronic components and a method thereof, which improve the mountingaccuracy of the electronic component by guiding the conductive bump ofthe electronic component to the predetermined positions of the substratewith a stopper.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of manufacturing a circuit boardstructure, comprising: providing a carrier board comprising a releaselayer; forming a stopper over the carrier board; disposing an adhesivelayer over the carrier board; abutting a conductive bump of anelectronic component against the stopper and placing the electroniccomponent over the carrier board; performing a build-up process; andremoving the carrier board.
 2. The method of manufacturing the circuitboard structure of claim 1, wherein the electronic component comprises achip, the chip has a first surface and a second surface that areoppositely disposed, and the conductive bump is located on the secondsurface, wherein the build-up process comprises: forming a plurality ofdielectric layers and circuits in the dielectric layers over the firstsurface of the chip.
 3. The method of manufacturing the circuit boardstructure of claim 2, further comprising forming an outer layer over thesecond surface of the chip and the conductive bump, and the outer layercomprises: an insulating layer; a via within the insulating layer andelectrically connected to the conductive bump; and a patterned circuitlayer disposed over the insulating layer and electrically connected tothe via.
 4. The method of manufacturing the circuit board structure ofclaim 1, wherein the abutting the conductive bump of the electroniccomponent against the stopper and placing the electronic component overthe carrier board comprises: abutting the conductive bump against afirst portion of the stopper; and abutting the conductive bump against asecond portion of the stopper, wherein the second portion isperpendicular to the first portion.
 5. The method of manufacturing thecircuit board structure of claim 1, wherein the disposing the adhesivelayer over the carrier board comprises: covering the stopper with theadhesive layer.